Electrolytic copper powder Progress in Research on Metal Fillers-Polymer Composite Electrically Conductive Adhesives 金属粉末-聚合物复合导电胶研究进展
Determination of trace antimony in electrolytic copper by FAAS; 对电解铜粉的氧化、还原过程作了实验研究。
The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years. 印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。
The Impact of Copper Wire Drawing by Hydrogen in Electrolytic Copper ( Part One: Electrolytic Copper ﹠ Smelting) 电解铜中的氢对铜线坯拉丝影响的实践(上篇:电解铜与熔炼)
A new process of producing electrolytic copper powder from anti-extracting bacterial leaching solution from copper ore of Ziji Mount Gold-Copper Mine was developed. 研究了直接利用紫金山金铜矿的铜矿细菌浸出反萃含铜溶液生产电解铜粉的新型工艺。
This paper presents main technical parameters, structural features, operation of electrolytic copper crane. 文中主要介绍电解铜起重机的主要技术参数、结构特点、工作原理等。
Development Trend of Electrolytic Copper Foil 电解铜箔产业发展趋势
Mn-Cu and Cu-Zn-Al alloys of varios compositions were prepared with electrolytic copper, manganese and zinc and industrial pure aluminium. Their damping capacity was measured under different original stresses. 采用电解铜、电解锰、电解锌、工业纯铝为原料,熔制了不同成分的MnCu系合金及CuZnAl合金,并测试了其在不同初始应力下的减振能力。
Research of galvanized process of electrolytic copper foil 电解铜箔镀锌工艺的研究
This paper introduces the application of electro-hydraulic proportional control technology to control the electrolytic copper stacking equipment. 采用电液比例控制技术对电解铜堆垛装置进行控制。
Filter Vessel Design in Electrolytic Copper Foil Production 电解铜箔生产中过滤器的设计总结
We get the conclusion that the microstructure evolution of electrolytic copper powder and atomizing copper powder was different in SPS process. 得到电解铜粉和雾化铜粉在SPS烧结过程中显微组织演变特征和规律不同的结论。
Technology of producing electrolytic copper powder by vacuum drying under low temperature 电解铜粉真空低温干燥生产工艺吸附式低温干燥过程干燥特性研究
Concentration of free citrate in citrate electrolytic copper stripping solution was determined by complexometric titration. 采用络合滴定法测定柠檬酸盐电解退铜液中游离柠檬酸根的浓度。
Study on Nickel Plating Treatment and Performances of Electrolytic Copper Foil 电解铜箔镀镍处理及其性能的研究
This article mainly tells that the produce craft control of electrolytic copper foils, surface treatment and the developmental direction for the future. 本文重点阐述了电解铜箔的生产工艺控制、表面处理方法以及今后的发展方向。
The effect of the types of copper powders ( atomization copper powder, electrolytic copper powder and ultra-fine grained copper powder), the content of binder and the pressing temperature on porosity distribution were investigated. 考察了钨骨架中Cu粉类型(雾化Cu粉,电解Cu粉,超细Cu粉)、粘结剂添加量和成形温度对钨骨架孔隙分布均匀性的影响。
Determination of free citrate in citrate electrolytic copper stripping solution 柠檬酸盐电解退铜液中游离柠檬酸根浓度的分析
Determination of Phosphorous in Tin Bronze, Brass and Electrolytic Copper with Single Extraction Molybdenum Blue Method 一次萃取钼蓝法测定锡青铜、黄铜、电解铜中的磷
Application of CM-TYPE anticorrosive waterproof agent in sulfate electrolytic copper Engineering CM型抗侵蚀防水剂在硫酸电解铜工程中的应用
A new post-treatment technics on electrolytic copper foil used for printed board was studied, including electroplating Zn-Ni based ternary alloy, chromate passivation, dipping for organic film. 研究了一种新的印制板用电解铜箔后处理工艺,依次进行电镀Zn-Ni基三元合金、铬酸盐钝化、浸有机膜等。
Automatic Process Control in Electrolytic Copper Foil Manufacturing 电解制造铜箔的工艺自动化控制
Effects of electrolyte composition, process conditions and anode types on particle size and output of electrolytic copper powder, current efficiency and the consuming of electric energy were studied, and surface morphology and phase structure of electrolytic copper power were analyzed. 研究了电解液组成、工艺条件及阳极种类对电解铜粉粒度、产量、电流效率和电耗的影响,分析了电解法制备的超细铜粉的表面形貌和相结构。
Influential factors for main mechanical properties of electrolytic copper foil 电解铜箔力学性能的主要影响因素
The effect of strip thickness on the cold-rolling and recrystallization texture of electrolytic copper 纯铜薄带的厚度对冷轧及再结晶织构的影响
A post-treatment technics on electrolytic copper foil used for printed board 印制板用电解铜箔后处理工艺的研究
According to Jiangxi electrolytic copper materials and process requirements, establishes the constraints. Finally obtains a multi-objective optimization model. 根据江铜电解材料和工艺要求,得到优化的约束条件,最后获得一个多目标优化模型。
With the development of copper smelting process and increasing demand for high-quality electrolytic copper, the requirements for copper anode casting control is also getting higher and higher. 随着铜冶炼工艺的不断发展和对高品质电解铜需求的增加,对铜阳极板浇铸控制的要求也越来越高。
Copper is a kind of very important raw materials and the basis of strategic goods. Electrolytic copper production process is the main approach to obtaining high purity refined copper products. 金属铜是一种十分重要的基础原料和战略物资,铜电解生产过程是获取高纯度精铜产品主要途径。
Electrolytic copper foil is an important raw material in the electronic and electrical industries, which provides the primary substrate and conductive circuits in printed circuit boards ( PCB) and printed wire boards ( PWB). 电解铜箔是电子和电气工业的重要原材料,主要用于覆铜板和印制线路板的制作。